Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference75 articles.
1. Handbook of Thin-Film Deposition Processes and Techniques;Schuegraf,1988
2. Thin Film Deposition;Smith,1995
3. Strength and electrical conductivity of a deformation-processed Cu-5 Pct Nb composite
4. Characterization of the strength and microstructure of heavily cold worked CuNb composites
5. Correlation of microstructure and type II superconductivity of a heavily cold rolled Cu-20mass% Nb in situ composite
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