Stronger silicon for microsystems
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Effects of microstructure on the strength and fracture toughness of polysilicon: a wafer level testing approach;Ballarini,2000
2. Mode I and mixed mode fracture of polysilicon for MEMS
3. On the toughening of brittle materials by grain bridging: Promoting intergranular fracture through grain angle, strength, and toughness
4. Strength and sharp contact fracture of silicon
5. Evaluation of fracture properties of silicon by combining resonance frequency and microtensile methods
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1. Effects of nano‐grain structures and surface defects on fracture of micro‐scaled polysilicon components;Journal of the American Ceramic Society;2020-02-03
2. Predicting strength distributions of MEMS structures using flaw size and spatial density;Microsystems & Nanoengineering;2019-11-04
3. A Review on Size‐Dependent Mechanical Properties of Nanowires;Advanced Engineering Materials;2019-06-21
4. Electropulse-induced laminated structures in a ferritic-pearlitic 35CrMo steel;Scripta Materialia;2019-05
5. Biaxial flexure testing of free-standing thin film membrane with nanoindentation system;Sensors and Actuators A: Physical;2018-08
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