Effects of coherency stress and vacancy sources/sinks on interdiffusion across coherent multilayer interfaces – Part I: Theory-Reference-Cited by-同舟云学术

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Effects of coherency stress and vacancy sources/sinks on interdiffusion across coherent multilayer interfaces – Part I: Theory

Published:2012-04 Issue:6-7 Volume:60 Page:2528-2538
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Wan Haibo,Shen Yao,Jin Xuejun,Chen Youxing,Sun Jian

Funder

National Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference49 articles.

1. Atomic mechanisms of interdiffusion in metallic multilayers

2. Investigation of interdiffusion in copper–nickel bilayer thin films

3. Pinch-off maps for the design of morphologically stable multilayer thin films with immiscible phases

4. Thermal stability of self-supported nanolayered Cu/Nb films

5. Transient Interface Sharpening in Miscible Alloys

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2. Point defect sink strength of low-angle tilt grain boundaries: A phase field dislocation climb model;International Journal of Plasticity;2019-08

3. Interdiffusion in epitaxial, single-crystalline Au/Ag thin films studied by Auger electron spectroscopy sputter-depth profiling and positron annihilation;Acta Materialia;2016-04

4. Phase-field modelling of spinodal decomposition in TiAlN including the effect of metal vacancies;Scripta Materialia;2015-01

5. Phase field microelasticity model of dislocation climb: Methodology and applications;Acta Materialia;2014-10

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