A DSC analysis of thermodynamic properties and solidification characteristics for binary Cu–Sn alloys
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Application of single pan thermal analysis to Cu–Sn peritectic alloys
2. Structural evolution in the solidification process of Cu–Sn alloys
3. X-ray diffraction experiments on In30Sn70 from normal liquid to solidus
4. The complex structure of liquid Cu6Sn5alloy
5. The structural change of Cu-Sn melt
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