The as-deposited structure of co-sputtered Cu–Ta alloys, studied by X-ray diffraction and molecular dynamics simulations

Author:

Müller Claudia M.,Parviainen Stefan,Djurabekova Flyura,Nordlund Kai,Spolenak Ralph

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference46 articles.

1. Cohesion in Metals: Transition Metal Alloys;de Boer,1989

2. Molecular dynamics simulations of Cu/Ta and Ta/Cu thin film growth;Klaver;J. Comput. Aided Mater. Des.,2003

3. C.H. Lee, S.H. Lee, J.S. Kim, Y.S. Kwon, Mechanical alloying effect in immiscible Cu-based alloy systems. Korus 2003: 7th Korea-Russia International Symposium on Science and Technology, Vol. 1 Proceedings 2003. p. 42.

4. Effect of milling temperature on mechanical alloying in the immiscible Cu-Ta system;Xu;Metall. Mater. Trans. A-Phys. Metall. Mater. Sci.,1997

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