Fracture characterization in patterned thin films by cross-sectional nanoindentation☆-Reference-Cited by-同舟云学术

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Fracture characterization in patterned thin films by cross-sectional nanoindentation☆

Published:2006-08 Issue:13 Volume:54 Page:3453-3462
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

OCANA I,MOLINAALDAREGUIA J,GONZALEZ D,ELIZALDE M,SANCHEZ J,MARTINEZESNAOLA J,GILSEVILLANO J,SCHERBAN T,PANTUSO D,SUN B

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesion strength of ductile thin film determined by cross-sectional nanoindentation;International Journal of Mechanical Sciences;2024-05

2. Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading;Microelectronics Reliability;2023-09

3. Micromechanical Adhesion Experiments and Simulation on Cu-Damascene Processed Test Devices;IEEE Transactions on Device and Materials Reliability;2023-03

4. Mechanical Robustness of Patterned Structures and Failure Mechanisms;More-than-Moore Devices and Integration for Semiconductors;2023

5. In-situ SEM micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects;2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2021-09-15

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