Nanosized induced low-temperature alloying in binary and ternary noble alloy systems for micro-interconnect applications-Reference-Cited by-同舟云学术

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Nanosized induced low-temperature alloying in binary and ternary noble alloy systems for micro-interconnect applications

Published:2011-02 Issue:3 Volume:59 Page:1184-1190
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Kao Tzu-Hsuan,Song Jenn-Ming,Chen In-Gann,Dong Teng-Yuan,Hwang Weng-Sing

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-Thermal-Budget Photonic Sintering of Hybrid Pastes Containing Submicron/Nano CuO/Cu2O Particles;Nanomaterials;2021-07-20

2. Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics;Japanese Journal of Applied Physics;2021-02-25

3. Fabrication of fully covered Cu–Ag core–shell nanoparticles by compound method and anti-oxidation performance;Nanotechnology;2020-02-10

4. Interconnect Fabrication on Polymer Substrate using Submicron/Nano Silver Particles with the Assistance of Low-Density Irradiations;JOM;2019-06-25

5. The “critical limits for crystallinity” in nanoparticles of the elements: A combined thermodynamic and crystallographic critique;Journal of Physics and Chemistry of Solids;2018-03

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