Revealing 3D intragranular micromechanical fields at triple junctions

Author:

Gustafson Sven E.ORCID,Ludwig WolfgangORCID,Rodriguez-Lamas RaquelORCID,Yildirim CanORCID,Shanks Katherine S.,Detlefs CarstenORCID,Sangid Michael D.ORCID

Funder

National Science Foundation

European Synchrotron Radiation Facility

U.S. Department of Energy

National Nuclear Security Administration

Sandia National Laboratories

Purdue University

Laboratory Directed Research and Development

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference55 articles.

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2. Microcracking in ceramics induced by thermal expansion or elastic anisotropy;Tvergaard;J. Am. Ceram. Soc.,1988

3. Finite element analysis about effects of stiffness distribution on stresses and elastic strain energy near the triple junction in a tricrystal;Chen;Mater. Sci. Eng. A.,2000

4. Deformation accommodation at triple junctions in columnar-grained nickel;Li;Metall. Mater. Trans. A Phys. Metall. Mater. Sci.,2019

5. On the stress distribution around a triple junction;Li;Philos. Mag. A Phys. Condens. Matter Struct. Defects Mech. Prop.,2000

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