Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference35 articles.
1. Hoffmann G. PhD thesis, University Erlangen-Nürnberg; 1996
2. Long-range internal stresses in cell and subgrain structures of copper during deformation at constant stress
3. The process of grain refinement in equal-channel angular pressing
4. Microstructural study of the parameters governing coarsening and cyclic softening in fatigued ultrafine-grained copper
5. Dinkel M. Master’s thesis. University Erlangen-Nürnberg; 2004
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