Creep of thin film Au on bimaterial Au/Si microcantilevers-Reference-Cited by-同舟云学术

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Creep of thin film Au on bimaterial Au/Si microcantilevers

Published:2004-05 Issue:8 Volume:52 Page:2133-2146
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Gall Ken,West Neil,Spark Kevin,Dunn Martin L.,Finch Dudley S.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference52 articles.

1. Infrared vision using uncooled micro-optomechanical camera;Perazzo;Appl. Phys. Lett.,1999

2. IR imaging using uncooled microcantilever detectors;Senesac;Ultramicroscopy,2003

3. Detection of infrared photons using the electronic stress in metal–semiconductor cantilever interfaces;Datskos;Ultramicroscopy,2000

4. Development of nanomechanical biosensors for detection of the pesticide DDT;Alvarez;Biosens. Bioelectron.,2003

5. Design and performance of a microcantilever-based hydrogen sensor;Baselt;Sensor Actuator B,2003

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2. Investigation of Thermal Creep in Metal-Based MEMS Cantilevers;Journal of Microelectromechanical Systems;2023-10

3. Effect of Deposition Temperature on Long-Term Residual Stress Evolution of Au Films;Materials;2023-05-10

4. Effect of Pulsed Laser Irradiation on Microstructure and Evolution of Residual Stress for Gold Film;Advanced Engineering Materials;2022-11-09

5. Length effect on the plastic deformation of SiO2 microcantilevers;Materials Science in Semiconductor Processing;2022-09

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