Assessment of geometrically necessary dislocation levels derived by 3D EBSD
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Some geometrical relations in dislocated crystals;Nye;Acta Mater.,1953
2. Der fundamentale Zusammenhang zwischen Versetzungsdichte und Spannungsfunktionen;Kröner;Z. Phys.,1955
3. Allgemeine Kontinuumstheorie der Versetzungen und Eigenspannungen;Kröner;Arch. Rotation. Mech. Anal.,1959
4. Continuous distributions of dislocations: a new application of the methods of non-Riemannian geometry;Bilby;Proc. R. Soc. Lond.,1955
5. Observation of lattice curvature near the interface of a deformed aluminium bicrystal;Sun;Phil. Mag. A,2000
Cited by 254 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mechanical performance and deformation mechanisms of ultrastrong yield strength Fe-Cr-Ni-Mn-N austenitic stainless steel at 4.2 Kelvin;Journal of Materials Science & Technology;2024-08
2. Correction of step size dependency in local misorientation obtained by EBSD measurements: Introducing equidistant local misorientation;Ultramicroscopy;2024-05
3. 3D in-situ characterization of dislocation density in nickel-titanium shape memory alloys using high-energy diffraction microscopy;Acta Materialia;2024-03
4. Water droplet erosion assessment in the initial stages on AISI 316 L using kernel average misorientation;Tribology International;2024-03
5. Effect of isothermal multidirectional compression on microstructure and mechanical properties of Al–Zn–Mg–Cu–Zr alloy with minor Sc addition;Materials Chemistry and Physics;2024-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3