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Fusion bonding of copper and silicon at -70 °C by electrochemistry

  • Published:2021-02 Issue: Volume:204 Page:116486
  • ISSN:1359-6454
  • Container-title:Acta Materialia
  • language:en
  • Short-container-title:Acta Materialia

Author:

Chien Po-Yen,Cheng Lin,Liu Cheng-Ying,Li Jhong-En,Lee Benjamin Tien-Hsi

Funder

Ministry of Science and Technology

MOST

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. Semiconductor Wafer Bonding: Science and Technology;Tong,1999

2. Institution of Electrical Engineers., Silicon Wafer Bonding Technology for VLSI and MEMS Applications;Auberton-Hervé,2002

3. Sealing of MEMS atomic vapor cells using Cu-Cu thermocompression bonding;Karlen;J. Microelectromech. Syst.,2019

4. Rapid Fabricating sub-50 nm FD-SOI: by Secondary Ion-Cut Processing;Lee,2018

5. Nanoscale layer transfer by hydrogen ion-cut processing: a brief review through recent U.S. patents;Lee;Recent Patents Nanotechnol.,2017

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