Permeation of niobium through grain boundaries in copper-Reference-Cited by-同舟云学术

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Permeation of niobium through grain boundaries in copper

Published:2024-08 Issue: Volume:274 Page:120002
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Sheu Emmeline^ORCID,Liu Tung Yan^ORCID,Williams Darrick J.,Baldwin Jon K.,Demkowicz Michael J.^ORCID

Funder

National Nuclear Security Administration

Los Alamos National Laboratory

High Performance Research Computing, Texas A and M University

U.S. Department of Energy

Office of Science

Basic Energy Sciences

Publisher

Elsevier BV

Reference49 articles.

1. Thermal stability of self-supported nanolayered Cu/Nb films;Misra;Philos. Mag.,2004

2. Stability of nanometer-thick layers in hard coatings;Barnett;MRS Bull.,2003

3. Structure–property–functionality of bimetal interfaces;Beyerlein;JOM,2012

4. Diffusion along grain boundaries in multilayer materials;Petelin;Steel Transl.,2013

5. The Cu-Ta (copper-tantalum) system;Subramanian;Bull. Alloy Phase Diagr.,1989

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal stability of 3D interface Cu/Nb nanolaminates;Scripta Materialia;2025-01

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