Linking simulated polycrystalline thin film microstructures to physical vapor deposition conditions-Reference-Cited by-同舟云学术

Linking simulated polycrystalline thin film microstructures to physical vapor deposition conditions

Published:2023-02 Issue: Volume:245 Page:118581
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Monti Joseph M.,Stewart James A.,Custer Joyce O.,Adams David P.,Depla Diederik^ORCID,Dingreville Rémi^ORCID

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

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