First-principle study of the oxidation mechanism of formaldehyde and hypophosphite for copper and nickel electroless deposition process
Author:
Funder
RCCS
NINS
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference37 articles.
1. Anodic oxidation of reductants in electroless plating;Ohno;J. Electrochem. Soc.,1985
2. Selective and blanket electroless copper deposition for ultralarge scale integration;Zhao;J. Electrochem. Soc.,1997
3. On the mechanism of electroless plating. I. Oxidation of formaldehyde at different electrode surfaces;Meerakker;J. Appl. Electrochem.,1981
4. On the mechanism of electroless plating. II. One mechanism for different reductants;Meerakker;J. Appl. Electrochem.,1981
5. On the mechanism of electroless plating. Part 3. Electroless copper alloys;Meerakker;J. Appl. Electrochem.,1990
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