In situ observation of Cu electrodeposition and dissolution behavior on Au(111) by high speed AFM-Reference-Cited by-同舟云学术

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In situ observation of Cu electrodeposition and dissolution behavior on Au(111) by high speed AFM

Published:2019-04 Issue: Volume:302 Page:422-427
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Yoshioka Taiki,Matsushima Hisayoshi,Ueda Mikito

Funder

Ministry of Education, Culture, Sports, Science and Technology

Iketani Science and Technology Foundation

Futaba Electronics Memorial Foundation

Hitachi Metals Materials Science Foundation

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference30 articles.

1. Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

2. Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology

3. Nanofabrication of Small Copper Clusters on Gold(111) Electrodes by a Scanning Tunneling Microscope

4. Electrodeposition of metals in microgravity conditions

5. Effect of gravitational strength on nucleation phenomena of electrodeposited copper onto a TiN substrate

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1. High‐Speed AFM Observation of Electrolytic Hydrogen Nanobubbles During Potential Scanning;Electrochemical Science Advances;2024-07-19

2. Comparative study of homoepitaxial Au (111) and Ag (111) layers: Insights from DFT simulations;International Journal of Electrochemical Science;2024-04

3. Adsorption and solar light activity of noble metal adatoms (Au and Zn) on Fe(111) surface: a first-principles study;Physical Chemistry Chemical Physics;2024

4. High-speed AFM studies of macromolecular dynamics at solid/liquid interfaces;Encyclopedia of Solid-Liquid Interfaces;2024

5. <i>In-situ</i> Observation of Electrode Surface Change by High-Speed AFM;Vacuum and Surface Science;2023-10-10

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