Alternating current electrogravimetry of copper electrodissolution in a sulfuric acid solution
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference46 articles.
1. Galvanostatic studies of the kinetics of deposition and dissolution in the copper+copper sulphate system;Mattsson;Trans. Faraday Soc.,1959
2. On the Kinetics of the Cu/Cu(aq)++ Electrode;Hurlen;Acta Chem. Scand.,1961
3. Mechanism of electrodeposition and dissolution processes of copper in aqueous solutions;Bockris;Trans. Faraday Soc.,1962
4. The Dependence of Charge Transfer and Surface Diffusion Rates on the Structure and Stability of an Electrode Surface: Copper;Bockris;J. Electrochem. Soc.,1962
5. Wiley: Modern Electroplating, 5th Edition − Mordechay Schlesinger, Milan Paunovic, (n.d.). http://eu.wiley.com/WileyCDA/WileyTitle/productCd-0470167785.html. (Accessed 6 October 2016).
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