Structural properties of electrodeposited Cu-Ag alloys-Reference-Cited by-同舟云学术

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Structural properties of electrodeposited Cu-Ag alloys

Published:2017-10 Issue: Volume:251 Page:475-481
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Bernasconi Roberto,Hart James L.,Lang Andrew C.,Magagnin Luca,Nobili Luca,Taheri Mitra L.

Funder

Office of Naval Research

FIPSE program of the US Department of Education

National Science Foundation

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference31 articles.

1. Electromigration in copper conductors;Lloyd;Thin Solid Films,1995

2. Electroplating of Cu(Ag) thin films for interconnect applications;Strehle;Microelectron. Eng.,2010

3. Thermodynamic properties of metastable Ag-Cu alloys;Najafabadi;J. Appl. Phys.,1993

4. Formation of a super-saturated solid solution in the Ag-Cu system by mechanical alloying;Uenishi;Mater. Sci. Eng. A,1991

5. Facile formation of Cu-Ag film by electrodeposition for the oxidation-resistive metal interconnect;Kim;J. Electrochem. Soc.,2012

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