Formulation and characterization of electrolyte for decorative gold plating based on mercaptotriazole-Reference-Cited by-同舟云学术

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Formulation and characterization of electrolyte for decorative gold plating based on mercaptotriazole

Published:2013-08 Issue: Volume:104 Page:330-336
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Dimitrijević Silvana,Rajčić-Vujasinović Mirjana,Alagić Sladjana,Grekulović Vesna,Trujić Vlastimir

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference40 articles.

1. Microbump formation by noncyanide gold electroplating;Watanabe;Journal of the Electrochemical Society,1999

2. High-performance gold plating for microdevices;Gemmler;Plating and Surface Finishing,1994

3. Gold plating optimization for tape automated bonding;Traut;Plating and Surface Finishing,1990

4. Gold bumps off the danger list;Jasper;European Semiconductor,2000

5. Some recent topics in gold plating for electronics applications;Okinaka;Gold Bulletin,1998

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2. ON THE INTERACTION OF H[AuCl2] WITH 2-ETHYLIMIDAZOLE INTERACTION OF [AuCl2]- WITH 2-ETHYLIMIDAZOLE AT 278-318K;THE BULLETIN OF THE TAJIK NATIONAL UNIVERSITY. SERIES OF ECONOMIC AND SOCIAL SCIENCES;2023-11-13

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4. A comprehensive review of various non-cyanide electroplating baths for the production of silver and gold coatings;International Materials Reviews;2022-12-16

5. Ab initio circular dichroism with the yambo code: Beyond the independent particle approximation;NUOVO CIM C-COLLOQ C;2022

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