1. Modern Electroplating;Schlesinger,2010
2. New electroforming technology pressure aid for LIGA process;Tsai;Microsystem Technologies,2004
3. Regularity and mechanism of Pb electrodeposition intensified by super gravity field;Wang;Acta Physico-chimica Sinica,2009
4. L.Pessel, Apparatus for electroplating metal, US Patent 2,465,747. 1949 Mar 29.
5. O.A. Becker, Apparatus for electroplating metal surfaces, in particular cut edges formed by stacking sheet metal panels cut to size, US Patent 4,081,347. 1978 Mar 28.