Monitoring Cu nodule formation using Ni marker layers
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference15 articles.
1. Structural Variation of Electrodeposited Copper Film with the Addition of an Excess Amount of H 2 SO 4
2. Morphologies of copper deposits obtained by the electrodeposition at high overpotentials
3. The comparison of galvanostatic and potentiostatic copper powder deposition on platinum and aluminium electrodes
4. Morphology, internal structure and growth mechanism of electrodeposited Ni and Co powders
5. Electrodeposition of Fe powder from acid electrolytes
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1. Surface Roughening and Growth-Promoting Effects of Nickel and Antimony on Nodules in Copper Electrorefining;Metallurgical and Materials Transactions B;2023-10-13
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