Author:
Togasaki Norihiro,Okinaka Yutaka,Homma Takayuki,Osaka Tetsuya
Subject
Electrochemistry,General Chemical Engineering
Reference10 articles.
1. Significance of inclusions in electroplated gold films for electronics applications
2. Hardening mechanisms of hard gold
3. Technical Proceedings of AESF SUR/FIN 95;Holmbom,1995
4. Defect Structure, Morphology, and Properties of Deposits;Rofagha,1995
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