Time Evolution of Stress and Microstructure in Electroplated Copper Films
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference33 articles.
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3. Accelerated Recrystallization in Electrodeposited Dual-Layer Copper Thin Films;Alshwawreh;J. Electrochem. Soc.,2013
4. Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films;Alshwawreh;Microelctr. Eng.,2012
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