Thermal tibial osteonecrosis: A diagnostic challenge and review of the literature
Author:
Publisher
Elsevier BV
Subject
Orthopedics and Sports Medicine,Emergency Medicine
Reference18 articles.
1. The effects of drilling force on cortical temperatures and their duration: an in vitro study;Bachus;Medical Engineering & Physics,2000
2. Interlocking intramedullary nailing with and without reaming for the treatment of closed fractures of the tibial shaft. A prospective, randomized study;Blachut;The Journal of Bone and Joint Surgery,1997
3. A skin and soft-tissue protector for intramedullary reaming;Case;Orthopaedic Review,1993
4. A prospective, randomized study of intramedullary nails inserted with and without reaming for the treatment of open and closed fractures of the tibial shaft;Finkemeier;Journal of Orthopaedic Trauma,2000
5. The influence of the size and condition of the reamers on bone temperature during intramedullary reaming;Garcia;The Journal of Bone and Joint Surgery,2004
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Bone Transport Treatment of Osteomyelitis Due to Thermal Osteonecrosis After IM Nailing of Tibial Stress Fracture Nonunion;JBJS Case Connector;2023
2. An overview of thermal necrosis: present and future;Current Medical Research and Opinion;2019-05-10
3. PDGF-Simvastatin Delivery Stimulates Osteogenesis in Heat-induced Osteonecrosis;Journal of Dental Research;2012-04-11
4. Prevalence of complications of open tibial shaft fractures stratified as per the Gustilo–Anderson classification;Injury;2011-12
5. Reamed versus minimally reamed nailing: A prospectively randomised study of 100 patients with closed fractures of the tibia;Injury;2011-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3