Piezoresistive CMOS sensor for out-of-plane normal stress

Author:

Lemke Benjamin,Baskaran Rajashree,Paul Oliver

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference59 articles.

1. CMOS-integrated stress sensor systems for mechanical sensing and packaging reliability testing;Paul,2009

2. Review Semiconductor piezoresistance for microsystems;Barlian;Proc. IEEE,2009

3. Silicon piezoresistive stress sensors and their application in electronic packaging;Suhling;IEEE Sens. J.,2001

4. Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies;Pustan,2008

5. Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors;Nysaether;J. Micromech. Microeng.,1998

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