Author:
Nimkar Nitesh D.,Bhavnani Sushil H.,Ellis Charles D.,Jaeger Richard C.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. F.P. Incropera, Liquid Cooling of Electronic Devices by Single Phase Convection, first ed., Wiley, Canada, 1999.
2. International Technology Roadmap for Semiconductors [ITRS], 2000, Update http://www.semichips.org.
3. Thermal management of electronic components with dielectric liquids;Bar-Cohen;JSME Int. J. Ser. B,1993
4. G.M. Chrysler, R.C. Chu, R.E. Simons, in: Proceedings of the ASME Itherm-1994 on Jet Impingement Boiling of a Dielectric Coolant in Narrow Gaps, 1994, pp. 1–8.
5. An integral heat sink for cooling microelectronic components;Bhavnani;J. Electron. Packaging,1993
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