Effect of tightening torque on transducer dynamics and bond strength in wire bonding-Reference-Cited by-同舟云学术

Effect of tightening torque on transducer dynamics and bond strength in wire bonding

Published:2008-02 Issue:2 Volume:141 Page:695-702
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Han Lei,Zhong Jue,Gao Gongzhi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Microelectronics Packaging Handbook [M], Part I;Tummala,1997

2. Wire bonding dynamics monitoring by wavelet analysis;Han;Sens. Actuators A,2007

3. Bondability window and power input for wire bonding;Han;Microelectron. Reliability,2006

4. Temperature effect in thermosonic wire bonding;Wu;Trans. Nonferrous Metals Soc. China,2006

5. Nonlinear behaviors of transducer dynamics for thermosonic bonding;Han,2006

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