Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Optical Networks;Ramaswami,2003
2. Effect of temperature cycling on angular alignment in add/drop filter-module packaging;Hsieh;J. Electron. Mater.,2003
3. Packaging of photonic devices using laser welding;Jang;Proc. SPIE,1996
4. Finite element simulation of the temperature cycling tests;Basaran;IEEE Trans. Comp. Packag. Manuf. Technol.,1997
5. Optical Electronics in Modern Communications;Yariv,1997