Secondary embossing method for the capsulation of high-sensitive flexible piezoresistive sensors-Reference-Cited by-同舟云学术

Secondary embossing method for the capsulation of high-sensitive flexible piezoresistive sensors

Published:2022-03 Issue: Volume:335 Page:113356
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Bai Xiaofeng,Du Yu,Gai Chenhui,Guo Yang,Liu Ying,Huang Yao,Xu Hong,Wu Daming,Sun Jingyao

Funder

National Natural Science Foundation of China

Natural Science Foundation of Beijing Municipality

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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