Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications-Reference-Cited by-同舟云学术

Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications

Published:2014-09 Issue: Volume:216 Page:158-166
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Zhao Pai,Deng Ning,Li Xiaowei,Ren Chaochao,Wang Zheyao

Funder

NSFC

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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