Study of corner compensating structures and fabrication of various shapes of MEMS structures in pure and surfactant added TMAH-Reference-Cited by-同舟云学术

Study of corner compensating structures and fabrication of various shapes of MEMS structures in pure and surfactant added TMAH

Published:2009-09 Issue:2 Volume:154 Page:192-203
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Pal Prem,Sato Kazuo,Shikida Mitsuhiro,Gosálvez Miguel A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference50 articles.

1. Silicon Micromachining;Elwenspoek,1998

2. Silicon microstructuring technology;Lang;Mater. Sci. Eng.: R,1996

3. The MEMS Handbook;Gad-el-Hak,2002

4. Bulk micromachining of silicon;Kovacs;IEEE Proc.,1998

5. Plasma etching – a discussion of mechanisms;Coburn;J. Vac. Sci. Technol.,1979

Cited by 61 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sensitivity enhancement of thermal acoustic particle velocity sensor based on metal film optimization;Sensors and Actuators A: Physical;2024-10

2. Two-layered microwell-array device for preparation of single-neuron culture samples;Journal of Micromechanics and Microengineering;2024-07-18

3. A low-cost electrowetting on dielectric semi-continuous pump for application to microfluidic reconfigurable devices;Experimental Thermal and Fluid Science;2024-06

4. Fabrication of the microfluidic channels in silicon wafers using isotropic wet etching method: the impact of the composition of HNA solution on etching;Microsystem Technologies;2024-05-16

5. Effect of IPA on Micromachining Characteristics of Silicon in KOH-Based Solution;Microactuators, Microsensors and Micromechanisms;2022-11-21