A novel back-shooting inkjet printhead using trench-filling and SOI wafer-Reference-Cited by-同舟云学术

A novel back-shooting inkjet printhead using trench-filling and SOI wafer

Published:2004-09 Issue:2-3 Volume:114 Page:392-397
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Baek S.S.,Lim H.-T.,Song H.,Kim Y.-S.,Bae K.-D.,Cho C.-H.,Lee C.-S.,Shin J.-W.,Shin S.-J.,Kuk K.,Oh Y.-S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference15 articles.

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2. D. Westberg, G.I. Anderson, A novel CMOS-compatible inkjet head, in: Proceedings of the Ninth International Conference on Solid-state Sensors and Actuators, Tech. Digest, Chicago, USA, June 1997, pp. 813–816.

3. R. Nayve, M. Fujii, A. Fukugawa, M. Murata, High resolution long array thermal inkjet printhead fabricated by anisotropic wet etching and deep Si RIE, in: Proceedings of the 16th Annual International Conference of IEEE on Micro Electro Mechanical Systems, Kyoto, Japan, January 2003, pp. 456–461.

4. A thermal inkjet printhead with monolithically fabricated nozzle plate and self-aligned ink feed hole;Lee;J. Microelectromech. Syst.,1999

5. B.J. Keefe, M.F. Ho, K.J. Courian, S.W. Steinfield, W.D. Childers, E.R. Tappon, K.E. Trueba, T.I. Chapman, W.R. Knight, J.G. Moritz III, Ink channel structure for inkjet printhead, US Patent 5594481 (1997).

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