Author:
Lin Meng-Ju,Chen Rongshun
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Critical review: adhesion in surface micromechanical structures;Maboudian;J. Vac. Sci. Technol. B,1997
2. Sticking in surface micromachining;Tas;J. Micromech. Microeng.,1996
3. R.S. Fearing, Survey of sticking effects for microparts handling, in: Human Robot Interaction and Cooperative Robots, Proceedings of the IEEE/RSJ International Conference on Intelligent Robots and Systems’95, vol. 2, 1995, pp. 212–217.
4. F. Arai, D. Andou, T. Fukuda, Adhesion forces reduction for micro-manipulation based on micro-physics, in: An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems, Proceedings of the Ninth Annual International Workshop on Micro Electro Mechanical Systems vol. 54, 1996 (MEMS’96), IEEE, 1996, pp. 354–359.
5. Y. Yee, K. Chun, J.D. Lee, C.J. Kim, Polysilicon surface-modification technique to reduce sticking of microstructures, Sens. Actuators A (52) (1996) 45–150.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献