Solvent assisted bonding of polymethylmethacrylate: Characterization using the response surface methodology-Reference-Cited by-同舟云学术

Solvent assisted bonding of polymethylmethacrylate: Characterization using the response surface methodology

Published:2009-11 Issue:1 Volume:156 Page:121-128
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Umbrecht F.,Müller D.,Gattiker F.,Boutry C.M.,Neuenschwander J.,Sennhauser U.,Hierold Ch.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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