Wafer level fabrication of hermetically sealed microcavity with robust metal interconnects for chip cooling application-Reference-Cited by-同舟云学术

Wafer level fabrication of hermetically sealed microcavity with robust metal interconnects for chip cooling application

Published:2007-09 Issue:1-2 Volume:139 Page:259-264
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Kou Chao-Tsun,Chao Tzu-Yuan,Chiang I.Ta,Cheng Y.T.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference16 articles.

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2. Novel microstructures and technologies applied in chemical analysis techniques;Spiering;Transducers’,1997

3. Micro-to-macro fluidic interconnectors with an integrated polymer sealant;Tsai;J. Micromech. Microeng.,2001

4. Polydimethylsioxane fluidic interconnects for microfludic systems;Li;IEEE Trans. Adv. Pack.,2003

5. 169 Kelvin Cryogenic Microcooler Employing a Condenser, Evaporator, Flow Restriction, and Counterflow Heat Exchanger;Burger,2001

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1. Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures;Journal of Micromechanics and Microengineering;2016-08-23

2. Thermal management using the bi-disperse porous medium approach;International Journal of Heat and Mass Transfer;2012-01