Development of bendable strain sensor with embedded microchannels using 3D printing-Reference-Cited by-同舟云学术

Development of bendable strain sensor with embedded microchannels using 3D printing

Published:2017-08 Issue: Volume:263 Page:593-599
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Agarwala Shweta,Goh Guo Liang,Yap Yee Ling,Goh Guo Dong,Yu Hao,Yeong Wai Yee,Tran Tuan

Funder

National Research Foundation (NRF) of Singapore

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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