Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology-Reference-Cited by-同舟云学术

Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology

Published:2007-07 Issue:1 Volume:138 Page:81-86
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Kwon Hyu-sang,Lee Kwang-Cheol

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

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3. Design of a MEMS acoustical beamforming sensor microarray;Chowdhury;IEEE Sens. J.,2002

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