Metallization of self-assembled organic monolayer surfaces by Pd nanocluster deposition
Author:
Funder
Helsinki University
Academy of Finland
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Reference42 articles.
1. Molecular sensing with the tunnel junction of an Au nanogap in solution;Dong;Nanotechnology,2007
2. Local density of states effects at the metal-molecule interfaces in a molecular device;Boyen;Nat. Mater.,2006
3. Adsorption at nanostructured surfaces from first principles;Gross;J. Comput. Theor. Nanosci.,2008
4. Electrochemically deposited Pd islands on an organic surface: the presence of Coulomb blockade in STM I(V) curves at room temperature;Shekhah;Phys. Chem. Chem. Phys.,2006
5. Reduced Pd density of states in Pd/SAM/Au junctions: the role of adsorbed hydrogen atoms;Kučera;Phys. Chem. Chem. Phys.,2012
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