Staphylococcus epidermidis
Author:
Publisher
Elsevier BV
Subject
Virology,Infectious Diseases,Microbiology (medical),Microbiology
Reference10 articles.
1. Staphylococcus epidermidis – the “accidental” pathogen;Otto;Nat. Rev. Microbiol.,2009
2. The giant staphylococcal protein Embp facilitates colonization of surfaces through Velcro-like attachment to fibrillated fibronectin;Khan;eLife,2022
3. Beyond sepsis: Staphylococcus epidermidis is an underestimated but significant contributor to neonatal morbidity;Dong;Virulence,2017
4. Commensal-dendritic-cell interaction specifies a unique protective skin immune signature;Naik;Nature,2015
5. Staphylococcus epidermidis and its dual lifestyle in skin health and infection;Severn;Nat. Rev. Microbiol.,2023
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Coupling of an Au@AgPt nanozyme array with an micrococcal nuclease-specific responsiveness strategy for colorimetric/SERS sensing of Staphylococcus aureus in patients with sepsis;Journal of Pharmaceutical Analysis;2024-08
2. Unveiling the airborne microbial menace: Novel insights into pathogenic bacteria and fungi in bioaerosols from nursery schools to universities;Science of The Total Environment;2024-06
3. Pathogenic potential of meat-borne coagulase negative staphylococci strains from slaughterhouse to fork;International Microbiology;2024-03-23
4. Genetic Diversification and Resistome of Coagulase-Negative Staphylococci from Nostrils of Healthy Dogs and Dog-Owners in La Rioja, Spain;Pathogens;2024-03-05
5. Pathogenic bacteria and fungi in bioaerosols from specialized hospitals in Shandong province, East China;Environmental Pollution;2024-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3