Author:
Tsai Chir-Jang,Tseng Wenjea J,Hsi Chi-Shiung
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Microelectronics Packaging Handbook;Tummala,1989
2. Ag–Pd thick film conductor for AlN ceramics;Kurihara;IEEE Trans. Compon. Hybrids Manuf. Technol.,1990
3. Development of a surface-treatment method for AlN substrate to improve adhesion with thick-film conductors;Kuromitsu;J. Adhesion Sci. Technol.,1998
4. Development of glass frit free metallization systems for AlN;Adlaßnig;J. Mater. Sci.,1998
5. Copper thick film for aluminum nitride substrates;Endoh;IEICE Trans. Electron,1996
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献