1. Refractory metallization of green ceramic;Chance;Metall Trans,1970
2. Interfacial bond strength in alumina ceramics metallized and cofired with tungsten;Otsuka;Am Ceram Soc Bull,1981
3. Bettinelli A, Boissier J, Guille J, Bernier JC. 1400°C alumina tungsten cosintering. In: Vincenzini P, editor. High Tech. Ceram. Amsterdam: Elsevier Sc. Pub. B. V., 1987;38b:1567–1574.
4. Ceramics in microelectronic packaging;Tummala;Am Ceram Soc Bull,1988
5. Advanced ceramic substrates for multichip modules with multilevel thin film inter connects;Foster;IEEE Trans Comput Hybrids Manuf Tech,1991