Solidification behavior and microstructure of Ag–Cu eutectic alloy at different sub-rapid cooling rates
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference45 articles.
1. The origin of anomalous eutectic structures in undercooled Ag–Cu alloy;Clopet;Acta Mater.,2013
2. Investigation of the origin of anomalous eutectic formation by remelting thin-gauge samples of an Ag-Cu eutectic alloy;Liu;Scripta Mater.,2020
3. Effects of solute, temperature and strain on the electrical resistivity of Cu–Ag filamentary composites;Yao;Phys. B,2008
4. Effects of Cr addition on the microstructural, mechanical and electrical characteristics of Cu–6 wt.% Ag microcomposite;Zhang;Scripta Mater.,2005
5. Solidification microstructures: recent developments, future directions;Boettinger;Acta Mater.,2000
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