Electrochemical nucleation and growth of copper deposition onto FTO and n-Si(100) electrodes
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference35 articles.
1. Damascene copper electroplating for chip interconnections
2. Copper Electrodeposition: Principles and Recent Progress
3. Efficient thin-film solar cells prepared by a sequential process
4. Characteristics of chemical-vapor-deposited copper on the Cu-seeded TiN substrates
5. Electrodeposition of Cu–Re alloy thin films
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