Effects of Ti2SnC MAX phase reinforcement content on the properties of copper matrix composite produced by friction stir back extrusion process
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference48 articles.
1. Microstructure, electrical and mechanical properties of Ti2AlN MAX phase reinforced copper matrix composites processed by hot pressing;Salvo;Mater. Char.,2021
2. Towards sustainable copper matrix composites: manufacturing routes with structural, mechanical, electrical and corrosion behaviour;Jamwal;J. Compos. Mater.,2020
3. Tribological behavior of Ti2SnC particulate reinforced copper matrix composites;Wu;Mater. Sci. Eng.,2006
4. Progress in research and development on MAX phases: a family of layered ternary compounds;Sun;Int. Mater. Rev.,2011
5. Characterisation of powder metallurgy Cu-ZrO2 composites;Khaloobagheri;Adv. Prod. Eng. Manag.,2013
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1. Effect of extrusion speed on properties of Cu−5vol.%Ti2SnC composite wire fabricated by friction stir back extrusion process;Transactions of Nonferrous Metals Society of China;2024-03
2. Mechanical Properties of Ti3AlC2/Cu Composites Reinforced by MAX Phase Chemical Copper Plating;Nanomaterials;2024-02-24
3. Study on the Constitutive Modeling of (2.5 vol%TiB + 2.5 vol%TiC)/TC4 Composites under Hot Compression Conditions;Materials;2024-01-27
4. Microstructure, mechanical, electrical and wear properties of friction stir back extruded copper-6 vol.%Ti2SnC composite material;Canadian Metallurgical Quarterly;2024-01-23
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