Phenylethynylnaphthalic endcapped imide oligomers with reduced cure temperatures
Author:
Publisher
Elsevier BV
Subject
Organic Chemistry,Polymers and Plastics,General Physics and Astronomy,Materials Chemistry
Reference23 articles.
1. Phenylethynyl containing imide oligomers
2. Resin Transfer Moldable Phenylethynyl Containing Imide Oligomers
3. Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride
4. High Temperature Transfer Molding Resins: Laminate Properties of PETI-298 and PETI-330
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1. Tailoring thermosetting benzoxazoles for optimal performance: Balancing thermal stability, dielectric properties, and processability;European Polymer Journal;2024-01
2. MD analysis on structure and property of thermosetting polyimides end-capped by phenylethynyl groups;Materials Today Communications;2023-12
3. Md Analysis on Structure and Property of Thermosetting Polyimides End-Capped by Phenylethynyl Groups;2023
4. Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package;Polymer;2022-03
5. Phenylethynyl terminated polyimide resin/carbon fiber composite catalytic cured at 300 °C and its performance;Journal of Adhesion Science and Technology;2021-03-18
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