Low dielectric constant and high thermal stability of liquid crystal epoxy polymers based on functionalized poly(phenylene oxide)-Reference-Cited by-同舟云学术

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Low dielectric constant and high thermal stability of liquid crystal epoxy polymers based on functionalized poly(phenylene oxide)

Published:2023-10 Issue: Volume:198 Page:112378
ISSN:0014-3057
Container-title:European Polymer Journal
language:en
Short-container-title:European Polymer Journal

Author:

Yang Hui,Yuan Guoming,Jiao Enxiang,Wang Kunxin,Diao WenJie,Li Zhao,Wu Kun,Shi Jun

Publisher

Elsevier BV

Subject

Organic Chemistry,Polymers and Plastics,General Physics and Astronomy,Materials Chemistry

Reference45 articles.

1. Fluorinated low molecular weight poly(phenylene oxide): Synthesis, characterization, and application in epoxy resin toward improved thermal and dielectric properties;Zhou;Eur. Polym. J.,2021

2. High specific surface area hybrid silica aerogel containing POSS;Ren;Microporous Mesoporous Mater.,2021

3. High-performance light-emitting diodes encapsulated with silica-filled epoxy materials;Li;ACS Appl. Mater. Interfaces,2013

4. Low dielectric constant and high toughness epoxy resin based on hyperbranched polyester grafted by flexible chain modified;Wang;J. Mater. Sci. Mater. Electron.,2019

5. Novolac cured epoxy resin/fullerene modified clay composites: applied to copper clad laminates;Tsai;RSC Adv.,2015

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1. Polyphenylene oxide/SiO2 composites: Towards ultra-low dielectric loss and high thermal conductivity of microwave substrates;Applied Surface Science;2024-11

2. Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging;European Polymer Journal;2024-11

3. Flame retardant, toughened, reinforced, transparent and long shelf-life one-component epoxy resins via a P/N/Si-containing hyperbranched polymer;Chemical Engineering Journal;2024-08

4. PS/PPO foam with excellent comprehensive properties prepared by integrated foaming and sintering strategy with microwave-assisted;Composites Communications;2024-06

5. Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field;European Polymer Journal;2024-06

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