Author:
Labossiere Paul E.W.,Dunn Martin L.,Cunningham Shawn J.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Reference45 articles.
1. Interfacial cracking from the free-edge of a long bi-material strip;Akisanya;Int. J. Solids Struct.,1997
2. Stress singularities at interface corners in bonded dissimilar materials;Bogy;Int. J. Solids Struct.,1971
3. A collocation procedure for determining fracture mechanics parameters at a corner;Carpenter;Int. J. Fract.,1984
4. Chen, W.T., Read, D., Questad, D., Sammakia, B., 1997. Opportunities and needs for interfacial fracture mechanics in microelectronic packaging industry. Application of Fracture Mechanics in Electronic Packaging, ASME, AMD-Vol. 222/EEP-Vol. 20, pp. 183–192.
5. Determination of stress intensity factors and boundary element analysis for interface cracks in dissimilar anisotropic materials;Cho;Eng. Fract. Mech.,1992
Cited by
52 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献