Effects of thermal properties and behavior of wheat starch and gluten on their interaction: A review
Author:
Publisher
Elsevier BV
Subject
Molecular Biology,General Medicine,Biochemistry,Structural Biology
Reference120 articles.
1. Influence of gluten and starch granules interactions on dough mixing properties in wheat (Triticum aestivum L.).;Gao;Food Hydrocoll.,2020
2. Thermal Food Processing: New Technologies and Quality Issues;Sun,2012
3. Insights into the formation and structures of starch–protein–lipid complexes;Wang;J. Agric. Food Chem.,2017
4. Structural and antigenic properties of thermally treated gluten proteins;Stănciuc;Food Chem.,2018
5. Changes in chemical interactions and protein conformation during heat-induced wheat gluten gel formation;Wang;Food Chem.,2017
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