Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model-Reference-Cited by-同舟云学术

Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model

Published:2020-09 Issue:3 Volume:3 Page:141-155
ISSN:2589-5540
Container-title:Nanotechnology and Precision Engineering
language:en
Short-container-title:Nanotechnology and Precision Engineering

Author:

Kwon Suk Bum,Nagaraj Aditya,Yoon Hae-Sung,Min Sangkee

Funder

NSF

University of Wisconsin-Madison

FANUC

Publisher

AIP Publishing

Subject

Automotive Engineering

Reference14 articles.

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3. Ductile regime nanomachining of single-crystal silicon carbide;Patten;J Manuf Sci Eng,2005

4. The brittle–ductile transition in silicon. I. Experiments;Samuels;P Roy Soc A Math Phys,1989

5. A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials;Arif;J Manuf Sci Eng,2013

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