A comprehensive review on fusion welding of high entropy alloys – Processing, microstructural evolution and mechanical properties of joints
Author:
Funder
Ministry of Education and Science of the Russian Federation
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Reference193 articles.
1. Multicomponent high-entropy cantor alloys;Cantor;Prog. Mater. Sci.,2021
2. Physical metallurgy of concentrated solid solutions from low-entropy to high-entropy alloys;Cheng;Curr. Opin. Solid State Mater. Sci.,2017
3. A Brief history of alloys and the birth of high-entropy alloys;Murty,2019
4. Core effect of local atomic configuration and design principles in AlxCoCrFeNi high-entropy alloys;Yang;Scripta Mater.,2020
5. A review on fundamental of high entropy alloys with promising high–temperature properties;Chen;J. Alloys Compd.,2018
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Metallurgical aspects of high entropy alloys;Journal of Alloys and Compounds;2024-11
2. Microstructure and mechanical properties of resistance spot welded dissimilar aluminum/steel joints fabricated using high entropy alloy as interlayer;Materials Characterization;2024-10
3. Laser weldability and interface microstructure of CoCrNi-based medium-entropy alloy to Inconel 718 superalloy;Materials Characterization;2024-10
4. Microstructure and mechanical characterization of diffusion bonded CoCrCuFeNi HEA/TC4 joints using a Ni interlayer;2023-12-06
5. A critical review on solid-state welding of high entropy alloys– processing, microstructural characteristics and mechanical properties of joints;Defence Technology;2023-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3